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19-3605; Rev 0; 2/05
KIT ATION EVALU ILABLE AVA
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch
General Description
The MAX9986 high-linearity downconversion mixer provides 10dB gain, +23.6dBm IIP3, and 9.3dB NF for 815MHz to 995MHz base-station receiver applications. With a 960MHz to 1180MHz LO frequency range, this particular mixer is ideal for high-side LO injection receiver architectures. Low-side LO injection is supported by the MAX9984, which is pin-for-pin and functionally compatible with the MAX9986. In addition to offering excellent linearity and noise performance, the MAX9986 also yields a high level of component integration. This device includes a double-balanced passive mixer core, an IF amplifier, a dual-input LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9986 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 265mA. The MAX9984/MAX9986 are pin compatible with the MAX9994/MAX9996 1700MHz to 2200MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9986 is also functionally compatible with the MAX9993. The MAX9986 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range.
Features
815MHz to 995MHz RF Frequency Range 960MHz to 1180MHz LO Frequency Range (MAX9986) 570MHz to 850MHz LO Frequency Range (MAX9984) 50MHz to 250MHz IF Frequency Range 10dB Conversion Gain +23.6dBm Input IP3 +12dBm Input 1dB Compression Point 9.3dB Noise Figure 67dBc 2LO-2RF Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 49dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with MAX9994/MAX9996 1700MHz to 2200MHz Mixers Functionally Compatible with MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available
MAX9986
Applications
850MHz W-CDMA Base Stations GSM 850/GSM 900 2G and 2.5G EDGE Base Stations cdmaOneTM and cdma2000(R) Base Stations iDEN(R) Base Stations Predistortion Receivers Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems
cdma2000 is a registered trademark of the Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. iDEN is a registered trademark of Motorola, Inc.
Ordering Information
PART MAX9986ETP MAX9986ETP-T MAX9986ETP+D TEMP RANGE PIN-PACKAGE -40C to +85C -40C to +85C -40C to +85C PKG CODE
20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm 20 Thin QFN-EP* T2055-3 5mm x 5mm
MAX9986ETP+TD -40C to +85C
*EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel.
Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 26.3mW/C above +70C)...........2.1W Note A: TC is the temperature on the exposed paddle of the package.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
JA .................................................................................+38C/W JC .................................................................................+13C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
DC ELECTRICAL CHARACTERISTICS
(MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 953, R2 = 619, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.)
PARAMETER Supply Voltage Supply Current LO_SEL Input-Logic Low LO_SEL Input-Logic High SYMBOL VCC ICC VIL VIH 2 CONDITIONS MIN 4.75 TYP 5.00 222 MAX 5.25 265 0.8 UNITS V mA V V
AC ELECTRICAL CHARACTERISTICS
(MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 815MHz to 995MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER RF Frequency Range LO Frequency Range IF Frequency Range Conversion Gain Gain Variation Over Temperature SYMBOL fRF fLO fIF GC (Note 2) (Note 2) MAX9984 (Note 2) TC = +25C TC = -40C to +85C Flatness over any one of three frequency bands: fRF = 824MHz to 849MHz fRF = 869MHz to 894MHz fRF = 880MHz to 915MHz P1dB (Note 3) Two tones: fRF1 = 910MHz, fRF2 = 911MHz, PRF = -5dBm/tone, fLO = 1070MHz, PLO = 0dBm, TA = +25C TC = +25C to -40C TC = +25C to +85C CONDITIONS MIN 815 960 570 50 9 10 -0.007 TYP MAX 995 1180 850 250 11 UNITS MHz MHz MHz dB dB/C
Conversion Gain Flatness
0.15
dB
Input Compression Point
12
dBm
Input Third-Order Intercept Point
IIP3
21
23.6
dBm
Input IP3 Variation Over Temperature
-1.7 +1.0
dB
2
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9986 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, +3dBm, PRF = -5dBm, fRF = 815MHz to 995MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF +25C, unless otherwise noted.) (Note 1)
PARAMETER Noise Figure SYMBOL NF CONDITIONS Single sideband, fIF = 190MHz fRF = 900MHz (no signal) fLO = 1090MHz fBLOCKER = 990MHz fIF = 190MHz (Note 4) PBLOCKER = +8dBm PBLOCKER = +11dBm MIN TYP 9.3 19 dB 24
MAX9986
PLO = -3dBm to to +85C, unless = 160MHz, TC =
UNITS dB
MAX
Noise Figure Under-Blocking
Small-Signal Compression Under-Blocking Condition LO Drive 2x2 Spurious Response at IF 3x3 LO1 to LO2 Isolation LO Leakage at RF Port LO Leakage at IF Port RF-to-IF Isolation LO Switching Time RF Port Return Loss
PBLOCKER = PFUNDAMENTAL = -5dBm +8dBm fFUNDAMENTAL = 910MHz PBLOCKER = fBLOCKER = 911MHz +11dBm -3 2LO-2RF 3LO-3RF PLO = +3dBm TC = +25C (Note 5) PLO = +3dBm PLO = +3dBm 50% of LOSEL to IF settled to within 2 LO1/2 port selected, LO2/1 and IF terminated PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm LO2 selected LO1 selected 42 42
0.3 dB 2 +3 67 62 87 77 49 50 -47 -30 46 50 20 27 dB 26 22 dB dB dBm dBm dB ns dB dBc dBm
LO Port Return Loss LO1/2 port unselected, LO2/1 and IF terminated IF Port Return Loss LO driven at 0dBm, RF terminated into 50, differential 200
Note 1: Note 2: Note 3: Note 4:
All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Operation outside this range is possible, but with degraded performance of some parameters. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021. Note 5: Guaranteed by design and characterization.
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Typical Operating Characteristics
(MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY
MAX9986 toc01
CONVERSION GAIN vs. RF FREQUENCY
MAX9986 toc02
CONVERSION GAIN vs. RF FREQUENCY
MAX9986 toc03
12 TC = -40C 11 CONVERSION GAIN (dB) TC = -25C
12
12
11 CONVERSION GAIN (dB)
11 CONVERSION GAIN (dB)
10
10
10
9 TC = +25C TC = +85C 8
9
PLO = -3dBm, 0dBm, +3dBm
9
VCC = 4.75V, 5.0V, 5.25V
8
8
7 740 790 840 890 940 990 1040 RF FREQUENCY (MHz)
7 740 790 840 890 940 990 1040 RF FREQUENCY (MHz)
7 740 790 840 890 940 990 1040 RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
MAX9986 toc04
INPUT IP3 vs. RF FREQUENCY
MAX9986 toc05
INPUT IP3 vs. RF FREQUENCY
VCC = 4.75V
MAX9986 toc06
26 TC = +85C 25 24 INPUT IP3 (dBm) 23 22 21 TC = -40C 20 19 740 790 840 890 940 990 TC = -25C TC = +25C
26 25 24 INPUT IP3 (dBm) 23 PLO = +3dBm, 0dBm, -3dBm 22 21 20 19
26 25 24 INPUT IP3 (dBm) 23 22 21 20 19 VCC = 5.25V VCC = 5.0V
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RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
MAX9986 toc07
NOISE FIGURE vs. RF FREQUENCY
MAX9986 toc08
NOISE FIGURE vs. RF FREQUENCY
IF = 190MHz 11 NOISE FIGURE (dB) 10 9 VCC = 4.75V, 5.0V, 5.25V 8 7 6
MAX9986 toc09
12 11 NOISE FIGURE (dB) 10 9 8 7 6
IF = 190MHz TC = +25C TC = +85C
12 IF = 190MHz 11 NOISE FIGURE (dB) 10 9 PLO = +3dBm, 0dBm, -3dBm 8 7 6
12
TC = -40C TC = -25C
760
820
880
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RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
4
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.)
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9986 toc10
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9986 toc11
2LO-2RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm 70 2LO-2RF RESPONSE (dBc) 65 60 VCC = 4.75V 55 VCC = 5.0V 50 45 VCC = 5.25V
MAX9986 toc12
75 70 2LO-2RF RESPONSE (dBc) 65
75 70 2LO-2RF RESPONSE (dBc) 65 60 55 50 45
PRF = -5dBm
TC = +85C
PRF = -5dBm PLO = +3dBm
75
PLO = 0dBm
TC = -40C, -25C 60 TC = +25C 55 50 45 740 790 840 890 940 990 1040 RF FREQUENCY (MHz)
PLO = -3dBm
740
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1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9986 toc13
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9986 toc14
3LO-3RF RESPONSE vs. RF FREQUENCY
PRF = -5dBm 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 VCC = 4.75V, 5.0V, 5.25V 65 60 55
MAX9986 toc15
95 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 65 60 55
PRF = -5dBm TC = +85C TC = +25C
95 PRF = -5dBm 90 3LO-3RF RESPONSE (dBc) 85 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 60 55
95
TC = -25C TC = -40C
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RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
MAX9986 toc16
INPUT P1dB vs. RF FREQUENCY
MAX9986 toc17
INPUT P1dB vs. RF FREQUENCY
VCC = 5.25V
MAX9986 toc18
14 TC = +25C 13 INPUT P1dB (dBm) 12 11 TC = -40C 10 9 8 740 790 840 890 940 990 TC = -25C TC = +85C
14 13 INPUT P1dB (dBm) 12 11 10 9 8 PLO = -3dBm, 0dBm, +3dBm
14 13 INPUT P1dB (dBm) 12 11 10 9 8
VCC = 4.75V VCC = 5.0V
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RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.)
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9986 toc19
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9986 toc20
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9986 toc21
60
60
60
LO SWITCH ISOLATION (dB)
LO SWITCH ISOLATION (dB)
55 TC = -40C, -25C 50
55
LO SWITCH ISOLATION (dB)
55
50
50
45
TC = +85C TC = +25C
45
PLO = -3dBm, 0dBm, +3dBm
45
VCC = 4.75V, 5.0V, 5.25V
40 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz)
40 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz)
40 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9986 toc22
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9986 toc23
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9986 toc24
-10 LO LEAKAGE AT IF PORT (dBm) -15 -20 -25 -30 -35 -40 900 950 1000 1050 1100 1150 TC = -40C, -25C
-10 LO LEAKAGE AT IF PORT (dBm) -15 -20 -25 -30 -35 PLO = -3dBm
-10 LO LEAKAGE AT IF PORT (dBm) -15 -20 -25 -30 -35 VCC = 5.25V
VCC = 5.0V
TC = +85C
TC = +25C -40 1200 900 950
PLO = +3dBm 1000 1050
PLO = 0dBm -40 1100 1150 1200 900 950 1000
VCC = 4.75V 1050 1100 1150 1200
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9986 toc25
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9986 toc26
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9986 toc27
-30 LO LEAKAGE AT RF PORT (dBm)
-30 LO LEAKAGE AT RF PORT (dBm)
-30 LO LEAKAGE AT RF PORT (dBm)
PLO = -3dBm, 0dBm, +3dBm -40
-40
TC = -40C, -25C
-40
VCC = 4.75V, 5.0V, 5.25V
-50 TC = +85C -60 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz) TC = +25C
-50
-50
-60 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz)
-60 900 950 1000 1050 1100 1150 1200 LO FREQUENCY (MHz)
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 160MHz, unless otherwise noted.)
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9986 toc28
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9986 toc29
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9986 toc30
60 55 RF-TO-IF ISOLATION (dB) TC = +85C 50 45 40 35 30 740 790 840 890 940 990 TC = +25C
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 35 30 PLO = -3dBm PLO = 0dBm
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 35 30 VCC = 4.75V, 5.0V, 5.25V
PLO = +3dBm
TC = -40C, -25C
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RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS vs. RF FREQUENCY
MAX9986 toc31
IF PORT RETURN LOSS vs. IF FREQUENCY
MAX9986 toc32
LO SELECTED RETURN LOSS vs. LO FREQUENCY
MAX9986 toc33
0 5 RF PORT RETURN LOSS (dB) 10 15 20 25 30 35 40 740 800 860 920 980 1040 PLO = -3dBm, 0dBm, +3dBm
0 5 IF PORT RETURN LOSS (dB) 10 15 20 25 30 35 40 VCC = 4.75V, 5.0V, 5.25V
0 LO SELECTED RETURN LOSS (dB)
10
20
PLO = +3dBm
30
PLO = -3dBm PLO = 0dBm
40 50
1100
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RF FREQUENCY (MHz)
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY
MAX9986 toc34
SUPPLY CURRENT vs. TEMPERATURE (TC)
VCC = 5.25V SUPPLY CURRENT (mA) 230
MAX9986 toc35
0 LO UNSELECTED RETURN LOSS (dB)
240
10 PLO = -3dBm, 0dBm, +3dBm
20
220
30
210 40 VCC = 4.75V 50 700 800 900 1000 1100 1200 1300 LO FREQUENCY (MHz) 200 -40 -15 10 35 60 85 TEMPERATURE (C) VCC = 5.0V
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Pin Description
PIN 1, 6, 8, 14 2 3 4, 5, 10, 12, 13, 17 7 9 11 15 16 18, 19 20 EP NAME VCC RF TAP GND LOBIAS LOSEL LO1 LO2 LEXT IF-, IF+ IFBIAS GND FUNCTION Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. Ground Bias Resistor for Internal LO Buffer. Connect a 619 1% resistor from LOBIAS to the power supply. Local Oscillator Select. Logic control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Local Oscillator Input 2. Drive LOSEL high to select LO2. External Inductor Connection. Connect a low-ESR, 30nH inductor from LEXT to GND. This inductor carries approximately 140mA DC current. Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). IF Bias Resistor Connection for IF Amplifier. Connect a 953 1% resistor from IFBIAS to GND. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
Detailed Description
The MAX9986 high-linearity downconversion mixer provides 10dB of conversion gain and +23.6dBm of IIP3, with a typical 9.3dB noise figure. The integrated baluns and matching circuitry allow for 50 singleended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 49dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9986's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in cellular band GSM, cdma2000, iDEN, and W-CDMA 2G/2.5G/3G base stations. The MAX9986 is specified to operate over a 815MHz to 995MHz RF frequency range, a 960MHz to 1180MHz LO frequency range, and a 50MHz to 250MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details.
RF Input and Balun
The MAX9986 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun.
LO Inputs, Buffer, and Balun
The MAX9986 is ideally suited for high-side LO injection applications with a 960MHz to 1180MHz LO frequency range. For a device with a 570MHz to 850MHz LO frequency range, refer to the MAX9984 data sheet. As an added feature, the MAX9986 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCC before digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 82pF DCblocking capacitor.
8
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SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch
A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. optimize the performance for a particular frequency band. Since approximately 140mA flows through this inductor, it is important to use a low-DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground.
MAX9986
High-Linearity Mixer
The core of the MAX9986 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF performance is typically 23.6dBm, 67dBc, and 9.3dB, respectively.
Layout Considerations
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9986 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
Differential IF Output Amplifier
The MAX9986 mixer has a 50MHz to 250MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50. No matching components are required. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9986's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9986 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes.
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values.
Chip Information
TRANSISTOR COUNT: 1017 PROCESS: SiGe BiCMOS
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to
_______________________________________________________________________________________
9
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT L1, L2 L3 C1 C2, C4, C7, C8, C10, C11, C12 C3, C5, C6, C9, C13, C14 C15 R1 R2 R3 T1 U1 VALUE 330nH 30nH 10pF 82pF 0.01F 220pF 953 619 3.57 4:1 balun MAX9986 DESCRIPTION Wire-wound high-Q inductors (0805) Wire-wound high-Q inductor (0603) Microwave capacitor (0603) Microwave capacitors (0603) Microwave capacitors (0603) Microwave capacitor (0402) 1% resistor (0603) 1% resistor (0603) 1% resistor (1206) IF balun Maxim IC
Pin Configuration/Functional Diagram
IFBIAS LEXT 16 GND 17 IF+ 19 IF18
20
VCC 1 RF 2 TAP 3 GND 4 GND 5 MAX9986
15 LO2 14 VCC 13 GND 12 GND 11 LO1
6 VCC
7 LOBIAS
8 VCC
9 LOSEL
10 GND
THIN QFN
10
______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Typical Application Circuit
VCC T1 3 R3 L1 C13 C14 L2 R1 IFBIAS C15 1 L3 LEXT GND IF+ IF4 2 6 IF OUTPUT
VCC
20
19
18
17
16
C3 C1 RF INPUT C5
C2
VCC RF TAP
C12 1 MAX9986 2 3 4 5 14 13 12 11 15 LO2 VCC GND GND C10 LO1 LO1 INPUT C11 LO2 INPUT VCC
C4
GND GND
6 LOBIAS VCC
7 VCC
8 LOSEL
9
10 GND
R2 VCC C6 C7 LOSEL INPUT
C8 C9
VCC
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11
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch MAX9986
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
QFN THIN.EPS
L
D2 D D/2 MARKING k L E/2 E2/2 E (NE-1) X e
C L C L
b D2/2
0.10 M C A B
XXXXX
E2
PIN # 1 I.D.
DETAIL A
e (ND-1) X e
e/2
PIN # 1 I.D. 0.35x45 DETAIL B
e
L1
L
C L
C L
L
e 0.10 C A 0.08 C
e
C
A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
H
1
2
COMMON DIMENSIONS
PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 40L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
EXPOSED PAD VARIATIONS PKG. CODES T1655-1 T1655-2 T1655N-1 T2055-2 T2055-3 T2055-4 T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 T4055-1
D2
MIN. NOM. MAX. MIN.
E2
NOM. MAX.
L
0.15
A A1 A3 b D E e k L L1 N ND NE JEDEC
NOTES:
DOWN BONDS ALLOWED
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. 0.65 BSC. 0.25 - 0.25 0.20 REF. 0.20 REF. 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.50 BSC. 0.50 BSC. - 0.25 0.25 0.20 REF. 0.15 0.20 0.25 4.90 5.00 5.10 4.90 5.00 5.10 0.40 BSC. 0.25 0.35 0.45
3.00 3.00 3.00 3.00 3.00 3.00 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.20
3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00
3.10 3.10 3.10 3.10 3.10 3.10 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.30
3.20 3.20 3.20 3.20 3.20 3.20 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.40
** ** ** ** ** ** 0.40 ** ** ** ** ** ** ** 0.40 ** ** ** ** ** **
NO YES NO NO YES NO YES NO NO YES YES NO NO YES YES NO NO YES NO NO YES
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60 - 0.30 0.40 0.50 16 4 4 WHHB 20 5 5 WHHC 28 7 7 WHHD-1 32 8 8 WHHD-2 40 10 10 -----
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3, AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. 13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", 0.05.
3.30 3.40 3.20
** SEE COMMON DIMENSIONS TABLE
PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
H
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

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